Examines the properties of the materials used in MEMS and MOEN assembly and evaluates them in terms of their routing, electrical performance, thermal management and reliability. This book discusses packaging methods such as: molded thermoplastic packages for MEMS, wafer-assembled RFID, and wafer-level stacked packaging.
Addresses the uses, applications, and developments of flexible circuitry, the most popular form of interconnection for applications requiring size and weight reduction, better impedance, reduced labour, and easy assembly.