Thermal Management Handbook for Electronic Assemblies

IMAPS , Sergent Jerry E. , Krum Al

Covers the practical issues that packaging engineers must consider with regard to the thermal management of printed circuit boards, hybrid circuits and multichip modules. This book contains data on material properties and circuit functions.
  • Limba : Engleza
  • Numar pagini : 650
  • ISBN : 9780070266995
Rating:
358.99 Lei
Disponibilitate : La comanda

Stocul este limitat la furnizorii nostri. Disponibilitatea si termenul de livrare va vor fi comunicate telefonic in maxim 48 de ore. Puteti anula comanda in cazul in care informatiile furnizate nu va sunt convenabile.